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期刊论文 26

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2023 4

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2017 5

2015 1

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2011 1

2010 1

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关键词

VO₂薄膜 1

仅1吸收 1

体硅键合技术 1

傅立叶红外光谱 1

光学透明 1

加权平均原则 1

加速湿热老化 1

化学键参数 1

半导体硅片；8 in；12 in；产业协同；先进制程 1

即时医疗 1

原子半径差比率 1

可调微波吸收器 1

大块金属玻璃 1

大调制深度 1

异质光子集成；光互连；晶圆级测试分析 1

循环肿瘤细胞 1

微电子机械系统封装技术 1

扫描电子显微镜（SEM） 1

断裂性质 1

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Patterned wafer bonding using ultraviolet adhesive

Rui ZHUO, Guanglan LIAO, Wenliang LIU, Lei NIE, Tielin SHI

《机械工程前沿（英文）》 2011年第6卷第2期页码 214-218 doi: 10.1007/s11465-011-0130-5

摘要：

The process of patterned wafer bonding using ultraviolet (UV) adhesive as the intermediate layer was studied. By presetting the UV adhesive guide-layer, controlling the thickness of the intermediate layer (1– 1.5 μm), appropriate pre-drying temperature (60°C), and predrying time (6 min), we obtained the intermediate layer bonding of patterned quartz/quartz. Experimental results indicate that patterned wafer bonding using UV adhesive is achieved under room temperature. The process also has advantages of easy operation, low cost, and no plugging or leakage in the patterned area after bonding. Using the process, a microfluidic chip for red blood cell counting was designed and fabricated. Patterned wafer bonding using UV adhesive will have great potential in the fabrication of microfluidic chips.

关键词： ultraviolet (UV) adhesive intermediate layer patterned wafer bonding

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Special issue: Technologies for future high-efficiency industrial silicon wafer solar cells

《能源前沿（英文）》 2017年第11卷第1期页码 1-3 doi: 10.1007/s11708-016-0436-4

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Morphologies of diblock copolymer confined in a slit with patterned surfaces studied by dissipative particle

FENG Jian, HUANG Yongmin, LIU Honglai, HU Ying

《化学科学与工程前沿（英文）》 2007年第1卷第2期页码 132-139 doi: 10.1007/s11705-007-0025-5

摘要： Diblock copolymers with ordered mesophase structures have been used as templates for nano-fabrication. Unfortunately, the ordered structure only exists at micrometer-scale areas, which precludes its use in many advanced applications. To overcome this disadvantage, the diblock copolymer confined in a restricted system with a patterned surface is proved to be an effective means to prohibit the formation of defects and obtain perfect ordered domains. In this work, the morphologies of a thin film of diblock copolymer confined between patterned and neutral surfaces were studied by dissipative particle dynamics. It is shown that the morphology of the symmetric diblock copolymer is affected by the ratio of the pattern period on the surface to the lamellar period of the symmetric diblock copolymer and by the repulsion parameters between blocks and wall particles. To eliminate the defects in the lamellar phase, the pattern period on the surface must match the lamellar period. The difference in the interface energy of different compartments of the pattern should increase with increasing film thickness. The pattern period on the surface has a scaling relationship with the chain length, which is the same as that between the lamellar period and the chain length. The lamellar period is also affected by the polydispersity of the symmetric diblock copolymer. The total period is the average of the period of each component multiplied by the weight of its volume ratio. The morphologies of asymmetric diblock copolymers are also affected by the pattern on the surface, especially when the matching period of the asymmetric diblock copolymer is equal to the pattern period, which is approximately equal to the lamellar period of a symmetric diblock copolymer with the same chain length.

关键词： weight nano-fabrication morphology matching dissipative particle

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The electrostatic-alloy bonding technique used in MEMS

WANG Wei, CHEN Wei-ping

《机械工程前沿（英文）》 2006年第1卷第2期页码 238-241 doi: 10.1007/s11465-006-0011-5

摘要： Electrostatic-alloy bonding of silicon wafer with glass deposited by Au to form Si/Au-glass water, and bonding of Si/Au-glass with silicon wafer were researched during fabrication of pressure sensors. The silicon wafer and glass wafer with an Au film resistor were bonded by electrostatic bonding, and then Si-Au alloy bonding was formed by annealing at 400vH for 2 h. The air sealability of the cavity after bonding was finally tested using the N filling method. The results indicate that large bond strength was obtained at the bonding interface. This process was used in fabricating a pressure sensor with a sandwich structure. The results indicate that the sensor presented better performances and that the bonding techniques can be used in MEMS packaging.

关键词： Si/Au-glass strength MEMS packaging process sandwich structure

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Ultraviolet exposure enhanced silicon direct bonding

Guanglan LIAO, Xuekun ZHANG, Xiaohui LIN, Canghai MA, Lei NIE, Tielin SHI,

《机械工程前沿（英文）》 2010年第5卷第1期页码 87-92 doi: 10.1007/s11465-009-0078-x

摘要： Ultraviolet (UV) exposure, as an additional technique following the traditional wet chemical activation processes, is applied to enhance hydrophilic silicon direct bonding. The effects of UV exposure on silicon wafers’ nano-topography and bonding strength are studied. It is found that the surface roughness of silicon wafers initially decreases and then increases with UV exposure time, and the bonding strength increases and then decreases accordingly. The correlations of annealing temperature and annealing time vs. bonding strength are experimentally explored. Results indicate that the bonding strength increases sharply then gently with increasing annealing temperature and annealing time using UV exposure. Besides, the reliability of silicon direct bonding with UV exposure enhancement after the high/low temperature cycle test, constant temperature and humidity test, vibration test and shock test is investigated. It follows from the results that the bonding strength of silicon wafer pairs with UV exposure decreases after the environmental tests, whereas the residual strength is still higher than that without UV exposure, and the variation trends of bonding strength vs. UV exposure time, annealing temperature and annealing time remain unchanged. Therefore, following the traditional wet chemical activation processes, appropriate UV exposure (about three minutes in this study) is effective and promising to enhance silicon direct bonding.

关键词： ultraviolet (UV) exposure silicon direct bonding bonding strength reliability

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A space solar cell bonding robot

FU Zhuang, ZHAO Yan-zheng, LIU Ren-qiang, DONG Zhi

《机械工程前沿（英文）》 2006年第1卷第3期页码 360-363 doi: 10.1007/s11465-006-0027-x

摘要： A space solar cell bonding robot system which consists of a three-axis Cartesian coordinate s robot, coating device, bonding device, orientation plate, and control subsystem was studied. A method, which can control the thickness o

关键词： Cartesian coordinate thickness three-axis Cartesian orientation control subsystem

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淀粉基API胶合木胶接结构破坏模式及失效机理

时君友,徐文彪,王淑敏

《中国工程科学》 2014年第16卷第4期页码 40-44

摘要：

以淀粉基水性高分子异氰酸酯（API）胶合木胶接结构为研究对象，以胶接的压缩剪切强度为评估指标，通过加速湿热老化试验对胶接结构的破坏模式和失效机理进行了研究。结果表明：胶接结构的断裂性质为韧性断裂，且随着老化时间的增加，其破坏模式为由内聚破坏向内聚破坏+界面破坏转变。在湿热老化试验前期温度对压缩剪切试样性能起主要作用，在老化后期湿度起主要作用。

关键词：胶接结构加速湿热老化断裂性质破坏模式

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Towards Cr(VI)-free anodization of aluminum alloys for aerospace adhesive bonding applications: A review

Shoshan T. Abrahami, John M. M. de Kok, Herman Terryn, Johannes M. C. Mol

《化学科学与工程前沿（英文）》 2017年第11卷第3期页码 465-482 doi: 10.1007/s11705-017-1641-3

摘要： For more than six decades, chromic acid anodizing (CAA) has been the central process in the surface pre-treatment of aluminum for adhesively bonded aircraft structures. Unfortunately, this electrolyte contains hexavalent chromium (Cr(VI)), a compound known for its toxicity and carcinogenic properties. To comply with the new strict international regulations, the Cr(VI)-era will soon have to come to an end. Anodizing aluminum in acid electrolytes produces a self-ordered porous oxide layer. Although different acids can be used to create this type of structure, the excellent adhesion and corrosion resistance that is currently achieved by the complete Cr(VI)-based process is not easily matched. This paper provides a critical overview and appraisal of proposed alternatives to CAA, including combinations of multiple anodizing steps, pre- and post anodizing treatments. The work is presented in terms of the modifications to the oxide properties, such as morphological features (e.g., pore size, barrier layer thickness) and surface chemistry, in order to evaluate the link between fundamental principles of adhesion and bond performance.

关键词： aluminum Cr(VI)-free surface pre-treatments anodizing adhesive bonding

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ARC welding method for bonding steel with aluminum

Zhenyang LU, Pengfei HUANG, Wenning GAO, Yan LI, Hanpeng ZHANG, Shuyan YIN

《机械工程前沿（英文）》 2009年第4卷第2期页码 134-146 doi: 10.1007/s11465-009-0033-x

摘要： When welding steel with aluminum, the appearance of intermetallic compounds of Fe and Al will decrease tenacity and increase rigidity, which leads to bad joint performance. A new type of low energy input (LEI) welding technology is introduced which can be used to weld steel with aluminum. Using the technology, brazing was located on the steel side and arc fusion welding on the aluminum side. The less heat input reduces the thickness of intermetallic compounds to 3-4 μm. Tensile strength tests prove that the joint breaks at the heat-affected zone and the strength is higher than 70% of the aluminum’s. Thus, the method can lead to a good performance joint.

关键词： joining of steel and aluminum low energy input welding arc welding fusion welding – brazing

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用于微电子机械系统封装的体硅键合技术和薄膜密封技术

王渭源,王跃林

《中国工程科学》 2002年第4卷第6期页码 56-62

摘要：

对静电键合、体硅直接键合和界面层辅助键合等三种体硅键合技术，整片操作、局部操作和选择保护等三种密封技术，以及这些技术用于微电子机械系统的密封作了评述，强调在器件研究开始时应考虑封装问题，具体技术则应在保证器件功能和尽量减少芯片复杂性两者之间权衡决定。

关键词：体硅键合技术薄膜密封技术微电子机械系统封装技术

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Hyperbranched magnetic polymer: highly efficient removal of Cr(VI) and application in electroplating wastewater

《化学科学与工程前沿（英文）》 2023年第17卷第10期页码 1568-1580 doi: 10.1007/s11705-023-2303-2

摘要： By using a two-step hydrothermal method and trithiocyanuric acid (TTCA), 2,4,6-trihydrazino-1,3,5-triazine (THT), and Fe₃O₄ as raw materials, a spherical magnetic adsorbent polymer (TTCA/THT@Fe₃O₄) was synthesized to achieve the efficient removal of Cr(VI) from wastewater. Under optimal adsorption conditions, the maximum adsorption capacity of TTCA/THT@Fe₃O₄ for Cr(VI) can reach 1340 mg∙g^‒1. Notably, the removal efficiency can approach 98.9%, even at the lower concentration of 20 mg∙L^‒1 Cr(VI). For actual wastewater containing Cr(VI), the Cr(VI) concentration was reduced from 25.8 to 0.4 mg∙L^‒1, a remarkable 20% lower than the current industry discharge standard value. A mechanism for the high adsorption performance of Cr(VI) on TTCA/THT@Fe₃O₄ was investigated using Fourier transform infrared spectroscopy, X-ray photoelectron spectroscopy, and density functional theory. It can be plausibly attributed to the formation of Cr/N and Cr/S coordination bonds. Additionally, surface electrostatic adsorption, reduction effects, and the spherical polymer structure increase the contact area with Cr(VI), maximizing adsorption. The synergistic effect of adsorption and reduction enhances the adsorption performance of TTCA/THT@Fe₃O₄ for Cr(VI) and total chromium in water. The resultant polymer has a simple preparation process, excellent adsorption performance, easy magnetic separation, and promising application for actual wastewater.

关键词： magnetic polymer chromium removal hydrogen bonding recyclability actual wastewater

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Effects of taping on grinding quality of silicon wafers in backgrinding

Zhigang DONG, Qian ZHANG, Haijun LIU, Renke KANG, Shang GAO

《机械工程前沿（英文）》 2021年第16卷第3期页码 559-569 doi: 10.1007/s11465-020-0624-0

摘要： Taping is often used to protect patterned wafers and reduce fragmentation during backgrinding of silicon wafers. Grinding experiments using coarse and fine resin-bond diamond grinding wheels were performed on silicon wafers with tapes of different thicknesses to investigate the effects of taping on peak-to-valley (PV), surface roughness, and subsurface damage of silicon wafers after grinding. Results showed that taping in backgrinding could provide effective protection for ground wafers from breakage. However, the PV value, surface roughness, and subsurface damage of silicon wafers with taping deteriorated compared with those without taping although the deterioration extents were very limited. The PV value of silicon wafers with taping decreased with increasing mesh size of the grinding wheel and the final thickness. The surface roughness and subsurface damage of silicon wafers with taping decreased with increasing mesh size of grinding wheel but was not affected by removal thickness. We hope the experimental finding could help fully understand the role of taping in backgrinding.

关键词： taping silicon wafer backgrinding subsurface damage surface roughness

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MEMS-based thermoelectric infrared sensors: A review

Dehui XU, Yuelin WANG, Bin XIONG, Tie LI

《机械工程前沿（英文）》 2017年第12卷第4期页码 557-566 doi: 10.1007/s11465-017-0441-2

摘要：

In the past decade, micro-electromechanical systems (MEMS)-based thermoelectric infrared (IR) sensors have received considerable attention because of the advances in micromachining technology. This paper presents a review of MEMS-based thermoelectric IR sensors. The first part describes the physics of the device and discusses the figures of merit. The second part discusses the sensing materials, thermal isolation microstructures, absorber designs, and packaging methods for these sensors and provides examples. Moreover, the status of sensor implementation technology is examined from a historical perspective by presenting findings from the early years to the most recent findings.

关键词： thermoelectric infrared sensor CMOS-MEMS thermopile micromachining wafer-level package

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Fabrication of Si-based three-dimensional microbatteries: A review

Chuang YUE, Jing LI, Liwei LIN

《机械工程前沿（英文）》 2017年第12卷第4期页码 459-476 doi: 10.1007/s11465-017-0462-x

摘要：

High-performance, Si-based three-dimensional (3D) microbattery systems for powering micro/nano-electromechanical systems and lab-on-chip smart electronic devices have attracted increasing research attention. These systems are characterized by compatible fabrication and integratibility resulting from the silicon-based technologies used in their production. The use of support substrates, electrodes or current collectors, electrolytes, and even batteries used in 3D layouts has become increasingly important in fabricating microbatteries with high energy, high power density, and wide-ranging applications. In this review, Si-based 3D microbatteries and related fabrication technologies, especially the production of micro-lithium ion batteries, are reviewed and discussed in detail in order to provide guidance for the design and fabrication.

关键词： three-dimensional (3D) wafer-scale Si-based anode micro-LIBs thin-film deposition

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Performance of steel bridge deck pavement structure with ultra high performance concrete based on resin bonding

《结构与土木工程前沿（英文）》 2021年第15卷第4期页码 895-904 doi: 10.1007/s11709-021-0759-z

摘要： This research investigated a pavement system on steel bridge decks that use epoxy resin (EP) bonded ultra-high performance concrete (UHPC). Through FEM analysis and static and dynamic bending fatigue tests of the composite structure, the influences of the interface of the pavement layer, reinforcement, and different paving materials on the structural performance were compared and analyzed. The results show that the resin bonded UHPC pavement structure can reduce the weld strain in the steel plate by about 32% and the relative deflection between ribs by about 52% under standard axial load conditions compared to traditional pavements. The EP bonding layer can nearly double the drawing strength of the pavement interface from 1.3 MPa, and improve the bending resistance of the UHPC structure on steel bridge decks by about 50%; the bending resistance of reinforced UHPC structures is twice that of unreinforced UHPC structure, and the dynamic deflection of the UHPC pavement structure increases exponentially with increasing fatigue load. The fatigue life is about 1.2 × 10⁷ cycles under a fixed force of 9 kN and a dynamic deflection of 0.35 mm, which meets the requirements for fatigue performance of pavements on steel bridge decks under traffic conditions of large flow and heavy load.

关键词： steel bridge deck pavement ultra-high-performance concrete epoxy resin composite structure bending fatigue performance